MicroJPM
Soldering Flux Paste (50g) - (AD52467)
Soldering Flux Paste (50g) - (AD52467)
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Description:
This is a low-viscosity, rosin-free, yellowish flux that can be used for PCB, BGA, PGA, computer and phone chip soldering and reballing. This flux is a halogen-free and rosin-free, non-conductive, non-corrosive, clean paste specifically designed for soldering conventional and surface-mount circuit assemblies. Essentially no residue remains after soldering. This flux has been developed for bare copper soldering applications. This integral formulation possesses improved wetting characteristics, which still exhibit superior corrosion inhibition properties and provide a non-tacky residue that is considered non-corrosive and non-conductive according to common industry specifications. This non-corrosive, non-conductive flux meets the most stringent requirements of Bellcore TR-NWT-000078 and IPC-SF-818 specifications. A major advantage of this flux is the reduced odor associated with the soldering process.
Specs:
- Flux paste
- Brand: Generic
- High quality
- High joint intensity
- Good immersion
- Neutral PH 7 土 0.3
- Non-toxic, Non-corrosive
- Good insulation
- Smooth welding surface.
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