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MicroJPM

NC-559-ASM Soldering Flux 10cc - (AD11956)

NC-559-ASM Soldering Flux 10cc - (AD11956)

Regular price $6.95 USD
Regular price Sale price $6.95 USD
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Description:

The NC-559-ASM is a high-viscosity, no-clean flux that can be used for PCB, BGA, PGA rework and soldering, and reballing of computer and phone chips.
 

These Flux models are under MIL-F-14256 standard and have been QPL approved as Type RMA or RL. Although the fluxing ability approximates that of RA type flux, the flux residue after soldering is neither corrosive nor conductive. This 186 flux has been developed for use in critical applications where difficult assemblies must be soldered, yet process requirements stipulate the use of Type RMA or RL flux. This flux possesses high thermal stability for soldering multi-layer assemblies that require a high preheat temperature. Exposure to high preheat temperatures does not degrade the residue's solubility in normal cleaning solvents. There is no degradation of surface insulation resistance caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue allows the residue to be left on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.

Specifications:

- Paste flux

- Type: NC-559-ASM

- Brand: Generic

- High quality

- High joint intensity

- Good immersion

- Neutral PH 7 ± 0.3

- Non-toxic, Non-corrosive

- Good insulation

- Smooth solder surface.

- Volume: 10 c.c.

- Dimensions: 98 x 20 mm (L x D)

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